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Please use this identifier to cite or link to this item: https://libeldoc.bsuir.by/handle/123456789/29246
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dc.contributor.authorShulgov, V. V.-
dc.date.accessioned2018-01-15T11:41:46Z-
dc.date.available2018-01-15T11:41:46Z-
dc.date.issued2017-
dc.identifier.citationShulgov, V. The Increase in Thermal Stability of Anodic Alumina Films on Aluminum / V. Shulgov // Book of Abstracts the 5th International Conference Oxide Materials for Electronic Engineering – fabrication, properties and application (ОМЕЕ-2017). – Р. 39.ru_RU
dc.identifier.urihttps://libeldoc.bsuir.by/handle/123456789/29246-
dc.description.abstractThermal stability of porous anodic alumina formed in various electrolytes is discussed. The bending deflection of the samples measured was converted to thermal stress. A model of transformation of the pore morphology during the re-anodizing in the electrolyte at the voltage increased relative to the voltage of the primary anodization is proposed.ru_RU
dc.language.isoenru_RU
dc.publisherВидавництво Львівської політехнікиru_RU
dc.subjectпубликации ученыхru_RU
dc.subjectaluminumru_RU
dc.subjectaluminum alloyru_RU
dc.subjectanodic aluminaru_RU
dc.subjectcrackru_RU
dc.subjectheat resistanceru_RU
dc.titleThe Increase in Thermal Stability of Anodic Alumina Films on Aluminumru_RU
dc.typeСтатьяru_RU
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