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Please use this identifier to cite or link to this item: https://libeldoc.bsuir.by/handle/123456789/32186
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dc.contributor.authorTimoshkov, Yu. V.-
dc.contributor.authorTimoshkov, V. Yu.-
dc.contributor.authorFrolov, A. Y.-
dc.contributor.authorKurmashev, V. I.-
dc.date.accessioned2018-06-25T13:56:23Z-
dc.date.available2018-06-25T13:56:23Z-
dc.date.issued2008-
dc.identifier.citationNanomaterials for optical microelectromechanical system technology / Yu. V. Timoshkov and others // Доклады БГУИР. - 2008. - № 5 (35). - С. 104 - 108.ru_RU
dc.identifier.urihttps://libeldoc.bsuir.by/handle/123456789/32186-
dc.description.abstractThe research is focused on the nanostructured materials processing and their application in microelectromechanical systems (MEMS), in general, and optical MEMS, in particular. In the frame­work of LIGA-like (Lithografie, Galvanoformung, Abforming) technology, anode and cathode cost effective technologies are developed. One of approaches to solve the fundamental problem of friction and wear of MEMS elements is application of the composite materials, in particular, cath­ ode codeposited metal and alloy with inert hard particles by electroless or electrochemical processes. Wear resistance of elements increased in 2-2.5 times, microhardness increased in 2 times, coefficient of friction and corrosion current were reduced by factor 1.5 and 1.6 respectively. Application of composite materials for moveable microelement with high reliability is the only way for real MEMS development. Anodic processes of aluminum and silicon anodizing result in nanopore structure. Anisotropy of the pores determines the unique properties of the films during chemical selective etching and provides aspect ratio up to 50 for MEMS microstructures.ru_RU
dc.language.isoenru_RU
dc.publisherБГУИРru_RU
dc.subjectдоклады БГУИРru_RU
dc.subjectmicroreliefru_RU
dc.subjectmicroelectromechanical systems (MEMS)ru_RU
dc.subjectcodepositionru_RU
dc.titleNanomaterials for optical microelectromechanical system technologyru_RU
dc.typeСтатьяru_RU
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