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Please use this identifier to cite or link to this item: https://libeldoc.bsuir.by/handle/123456789/6765
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dc.contributor.authorSokol, V.-
dc.contributor.authorShulgov, V. V.-
dc.date.accessioned2016-05-13T11:06:02Z-
dc.date.accessioned2017-07-27T12:27:08Z-
dc.date.available2016-05-13T11:06:02Z-
dc.date.available2017-07-27T12:27:08Z-
dc.date.issued2015-
dc.identifier.citationSokol, V. Thermal stability of anodic layers on aluminum alloys abstract / V. Sokol, V. Shulgov // Solid State Phenomena. - 2015. - Vol. 230. - Pp. 14 - 18.ru_RU
dc.identifier.urihttps://libeldoc.bsuir.by/handle/123456789/6765-
dc.description.abstractThe thermal stability of anodic alumina layers made by the open circuit potential measurements and electron microscopy is discussed. The crack growth resistance of the anodic alumina layers has been studied depending on the initial aluminum alloy composition and the anodization regimes.ru_RU
dc.language.isoenru_RU
dc.publisherSolid State Phenomenaru_RU
dc.subjectпубликации ученыхru_RU
dc.subjectaluminum alloysru_RU
dc.subjectaluminumru_RU
dc.subjectanodic aluminaru_RU
dc.subjectcrackru_RU
dc.subjectheat resistanceru_RU
dc.titleThermal stability of anodic layers on aluminum alloys abstractru_RU
dc.typeArticleru_RU
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